Sodium hypophosphite

Currently , formaldehyde and sodium hypophosphite are widely used as reducing agent of electroless copper plating , and have high technical maturity . However , considering the problem of environmental factors and plating quality , a more excellent reducing agent is needed urgently .

目前，作为化学镀铜溶液中的还原剂，甲醛和次磷酸钠的应用最为广泛且工艺成熟，可是，考虑到环境因素及镀层质量等问题，亟需寻求一种性能更优异的化学镀铜体系。

The repid methods for determination of Ni ~ ( 2 + ) and sodium hypophosphite concentrations in acidic and basic electroless Ni plating baths have been suggested based on the basic principle of linear sweep voltammetry and relative technique .

根据线性扫描伏安法的基本原理和有关的实验技术提出酸性和碱性化学镀镍液中Ni~（2+）和次磷酸钠浓度的快速测定法。

Experimental Study on the Preparation of Sodium hypophosphite from Phosphorus Sludge

泥磷制取次磷酸钠实验研究

Research for the preparation of sodium hypophosphite and reaction kinetics

次磷酸钠制备及反应动力学研究

Study on integrated utilization of by-products produced from industrial production of sodium hypophosphite

次磷酸钠工业生产副产物综合利用研究

Study on the preparation of sodium hypophosphite by one-stage process

一步法制备次磷酸钠的研究

Study on the Preparation of Silver Nanoparticles by Chemical Reduction Using Sodium Hypophosphite in Solution

次磷酸钠液相化学还原法制备纳米银粉的研究

High-speed Preparation of Nanometer Silver by Reduction with Sodium Hypophosphite in Liquid Phase

次磷酸盐液相还原法快速制备纳米银粉

A Study of the Reduction Efficiency of Sodium Hypophosphite in Low Temperature Electroless Nickel Bath

低温化学镀镍液中次磷酸钠还原效率的研究

The progress in research of electroless nickel deposition in sodium hypophosphite bath

次亚磷酸钠体系化学镀镍的研究进展

Using phosphorus sludge react with alkali solution to get sodium hypophosphite is an effective method .

泥磷与碱液反应制取次磷酸钠是一种有效回收单质磷的方法。

Catalysis of Sodium Hypophosphite on Citric Acid Finishing System

次磷酸钠在CA整理体系中的催化作用

Influence of Maleic Acid on the Deposition Behavior of Sodium Hypophosphite Electroless Copper Plating

马来酸对次磷酸钠化学镀铜沉积行为的影响

Studies on Cu-Ni alloy electroless plating using sodium hypophosphite as reductant ;

选用次亚磷酸钠作还原剂，用化学镀的方法制备了铜镍合金化涤纶织物。

Investigation of Sodium Hypophosphite Anodic Oxidizing Behavior in the Process of Acid Electroless Nickel Deposition

酸性化学镀镍中次亚磷酸钠阳极氧化行为的研究

Preparation of high purity sodium hypophosphite

高品位次磷酸钠的制备

And the bottom-up electroless nickel filling was first achieved , using sodium hypophosphite as a reducing agent .

并且首次实现了在次磷酸钠作为还原剂的化学镀镍体系的超级化学镍填充。

Sodium hypophosphite is strong reducing agent and with high economic value , widely used in chemical plating , food processing and other industries .

制得的次磷酸钠是一种强还原剂，广泛应用于化学镀、食品加工等行业，具有较高的经济附加值。

Sodium hypophosphite is used as reducing agent for electroless plating Ni-W-P and Ni-Co-P.

化学镀Ni-W-P、Ni-Co-P采用次磷酸钠作为还原剂。

Sodium hypophosphite had the considerable economical value , was widely used in chemical plating , galvanization and so on .

次磷酸钠具有很高的经济附加值，广泛应用于化学镀、电镀等多个行业。

Sodium hypophosphite as an additive played a role of increasing nucleation and accelerating the initial deposition during electrodeposition .

次亚磷酸钠在石墨粉体电沉积铜过程中起诱导成核，加速初始沉积的作用。

After 1h deposition , sodium hypophosphite was consumed by above 95 % because of decomposition .

经过1h的电沉积后，次亚磷酸钠分解95%以上。

Under the acidic and heating conditions , germanium dioxide reacts with sodium hypophosphite to give germanium chloroform .

在酸性条件下，二氧化锗与次亚磷酸钠经加热反应生成三氯甲锗烷，再与丙烯酸反应生成三氯代锗丙酸（中间体）。

Voltammetric Determination of Ni ~ ( 2 + ) and Sodium Hypophosphite Concentrations in Electroless Ni Plating Baths

伏安法测定化学镀镍液中Ni~（2+）和次磷酸钠浓度

Electrodeposited Ni P composite coatings incorporating a variety of inorganic particles were obtained from Watt 's nickel bath containing sodium hypophosphite .

Ni－P复合材料电镀涂层是在溶有次磷酸钠的瓦特镍池中不同无机物颗粒沉淀的混合物。

Based on catalyzing hypothesis of sodium hypophosphite , we explored and studied a non-phosphorus catalyst & sodium nitrilotriacetate .

依据次磷酸钠在体系中的催化作用开发和研究了无磷催化剂氨三乙酸钠。

The reaction mechanism of electroless nickel plating is analyzed ; a concept of the reduction efficiency of sodium hypophosphite proposed ; and the calculation formula for the efficiency derived .

对化学镀镍的反应机理进行分析，提出次磷酸钠还原效率的概念，推导出次磷酸钠还原效率的计算公式。

Ammonium molybdate and sodium hypophosphite are the chief formulation of coloring agent . Coloration after electroless Ni-P plating and color change after heat treatment are adopted .

发现钼酸铵和次亚磷酸钠可以作为着色液的主要成分，并确定了化学镀Ni-P后着色和着色后再进行热处理变色的二种工艺方法。

And the content of sodium hypophosphite in the product is 98.79 % , the content of sodium phosphite is 1.17 % and the content of Calcium is 0.03 % .

产品中次磷酸钠得含量为98.79%，亚磷酸钠的含量为1.17%，钙的含量为0.03%。

Silver nanoparticles were prepared by the reduction reaction of silver nitrate solution with sodium hypophosphite in polyvinylpyrrolidone solution . The silver sol was coagulated by adding ammonia solution .

以次磷酸钠液相还原法制备纳米银溶胶，通过添加试剂破坏银溶胶的稳定性，使银粒子产生聚沉或絮凝，分析了纳米银溶胶的稳定条件。